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Description
- 5G DONGLE Module, 4 Antennas, USB3.1 Port, Aluminum Alloy Heatsink by Waveshare
- M.2 Key B
- Comes with a customized aluminum alloy heatsink
- Features four SMA antenna connectors
- Provides good heat dissipation
- Onboard SIM card slot
- Support SIMCom and Quectel 5G module
The Waveshare 5G DONGLE Module, 4 Antennas, USB3.1 Port, Aluminum Alloy Heatsink comes with a customized aluminum alloy heatsink, good heat dissipation, nice-looking, protective, and durable. Onboard power and network indicators, with multiple reserved pads, for checking module operating status and testing other functions.
Support 5G modules with M.2 (NGFF) Key B interface, compatible with SIMCom and Quectel 5G modules. Features USB 3.1 Type-A port for connecting to PC, Raspberry Pi, or Jetson Nano host board to enable high-speed 5G network. PCB ENIG process reserved multi slots and positioning holes for integration.
- 1x USB TO M.2 B KEY
- 1x Aluminum Alloy Case (top and bottom)
- 4x Antenna
- 4x IPEX Adapter Cable
- 1x USB Type-A Extension Cable
- 4x SMA Protective Cap
- 1x Thermal Tape
- 1x Screw Pack
Size
- 75 x 30.1 x 20.8 mm (L x W x H)
- Antenna Height: 128.8 mm
- Antenna: 4
- IPEX adapter cable: 4
- Heatsink Material: Aluminum alloy
- USB Type-A extension cable: Included
- SMA Protective Cap: 4
- Thermal tape: Included
- SIM card slot: Included
- Power and network indicators: Yes
- Weight: 157 g