Seeed Studio XIAO MG24 w/ 2x 7-Pin Header

SeeedStudioSKU: RBC-Sed-51
Manufacturer #: 102010590

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Description

  • Seeed Studio XIAO MG24 w/ 2x 7-Pin Header
  • Features ARM Cortex-M33 core for high performance
  • Supports Matter over Thread/BLE 5.3
  • Ensures ultra-low power at 1.95μA
  • Offers 19 GPIOs and on-board antenna
  • Compact 21x17.8mm design for wearables

The Seeed Studio XIAO MG24 w/ 2x 7-Pin Header is an ultra-low-power wireless development board featuring a high-performance ARM Cortex-M33 core. It supports Matter protocols over Thread and Bluetooth Low Energy 5.3, making it ideal for IoT applications, particularly those that are battery-powered.

This compact board includes 4MB of Flash memory, 19 GPIOs, and an on-board antenna, ensuring outstanding RF performance. Its classic thumb-sized design is perfect for space-limited projects, such as wearables, and it is compatible with various XIAO accessory add-ons and kits.

  • 1x Seeed Studio XIAO MG24 w/ 2x 7-Pin Header
  • 2x 7-Pin Header

  • 21 x 17.8 mm
  • High-Performance MCU: Silicon Labs' EFR32MG24 SoC, 32-bit 78 MHz ARM Cortex-M33 with DSP instruction
  • Matter Native: Compatible with Matter over Thread and Bluetooth Low Energy 5.3, supported by the Arduino Core
  • Outstanding RF Performance: Equipped with an on-board antenna with BLE range up to 50m in open locations without signal interference, with an interface for an external UFL antenna
  • Ultra-Low Power Design: Power consumption less than 1.95μA in sleep mode, ideal for battery-powered projects
  • Rich On-Board Resources: Includes additional 4MB Flash, on-board battery charging circuit, 19 GPIOs, and LED
  • Security Encrypted On-Chip: Dedicated hardware secure engine with its own CPU enables Secure Vault functions
  • Classic XIAO Design: Maintains the classic XIAO design with a thumb-size form factor and single-sided mount, suitable for space-limited projects
  • XIAO Accessory Add-ons and Kits Compatibility: Compatible with all XIAO accessory add-ons and kits, including Grove Expansion, CAN-Bus, LED Matrix, Vision AI Sensor, Round Display, GSP Module, 2-Mic Array, ePaper Display, mmWave sensor, and LoRa Module

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